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Research on Laser Soldering Methods
Introduction to Shinwa's Initiatives We are conducting joint research on laser soldering methods compatible with surface mount and through-hole mounting, in collaboration with Senju Metal Industry, Japan Unix, and Shinwa. We aim to establish the conditions for laser soldering for through-hole mounting, developing THD and SMD in parallel.
We propose automation of equipment tailored to your needs.
We would like to introduce the "Laser Soldering Equipment" handled by OMC Corporation. Compatible with various devices from Panasonic Production Engineering, including semiconductor infrared lasers of 10W/30W/75W and blue lasers of 10W/50W. We offer PC/PLC control, dedicated machines/inline machines, and support for solder wire feeding devices/cream solder dispensers from various manufacturers. We will build a system using the equipment of your choice according to your budget. 【Features】 ■ Easy operation for high-quality soldering ■ Suitable for fine processing (minimum spot diameter: 0.4mm, solder wire diameter: φ0.3mm) ■ Establishment of a Class 4 laser management area, ensuring comprehensive safety measures ■ Equipped with semiconductor lasers from Panasonic Production Engineering *For more details, please refer to the PDF document or feel free to contact us.
Unifying coating and area laser soldering. Achieve space-saving and time-saving with this one machine!
**Features** ◆ Space-saving By consolidating two different processes into one, we have achieved a 30% reduction in space compared to the traditional two equipment setups. Inline integration becomes easier. ◆ Time-saving By adopting area lasers, simultaneous soldering can be performed on multiple pins. A cycle time of 0.7 seconds per pin for solder application is now possible. This achieves a 60% reduction in cycle time compared to wire soldering and spot lasers. ◆ Labor-saving Non-contact operation allows for implementation in narrow spaces where the soldering tip cannot reach, without putting stress on the circuit board or terminals. Maintenance such as cleaning or replacing the soldering tip is unnecessary, facilitating automation through continuous operation. ◆ Energy-saving Since no soldering tip is used, the cost of consumables is reduced. Additionally, compared to solder baths and reflow ovens, there is no need for constant heating, allowing for savings on electricity costs. ◆ Enhanced customization capability We cater to various needs such as product size, weight, flow direction, and appearance inspection.
